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Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing
Desai, Chandrakant S., Wang, Zhichao, Whitenack, Russell, Kundu, TribikramVolume:
126
Year:
2004
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1756146
File:
PDF, 1006 KB
english, 2004