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Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing
Lai, Yi-Shao, Chiu, Ying-TaVolume:
130
Year:
2008
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2957325
File:
PDF, 548 KB
english, 2008