Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip...

Journal of Electronic Packaging 2009 Vol. 131; Iss. 2

Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization

Lai, Yi-Shao, Chiu, Ying-Ta, Lee, Chiu-Wen
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Volume:
131
Year:
2009
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.3103945
File:
PDF, 880 KB
english, 2009
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