Design of the printing pattern on film for three-dimensional molded interconnect devices
Liu, Ren Hao, Young, Wen-Bin, Ming, Hsu PeLanguage:
english
Journal:
Advances in Polymer Technology
DOI:
10.1002/adv.21830
Date:
May, 2017
File:
PDF, 1.30 MB
english, 2017