Carrier Mobility Shift in Advanced Silicon Nodes Due to...

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Journal of Electronic Packaging 2017 / 04

Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip Package Interaction

Sukharev, Valeriy, Choy, Jun-Ho, Kteyan, Armen, Hovsepyan, Henrik, Nakamoto, Mark, Zhao, Wei, Radojcic, Riko, Muehle, Uwe, Zschech, Ehrenfried
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Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4036402
Date:
April, 2017
File:
PDF, 2.73 MB
english, 2017
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