[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Correlation of board and joint level test methods with strain dominant failure criteria for improving the resistance to pad cratering
Zhang, Qiming, Lo, Jeffery C. C., Lee, S. W. RickyYear:
2016
Language:
english
DOI:
10.1109/icept.2016.7583078
File:
PDF, 2.17 MB
english, 2016