Low Ceiling Temperature Polymer Microcapsules with...

ACS Applied Materials & Interfaces 2017 / 05

Low Ceiling Temperature Polymer Microcapsules with Hydrophobic Payloads via Rapid Emulsion-Solvent Evaporation

Tang, Shijia, Yourdkhani, Mostafa, Possanza Casey, Catherine M., Sottos, Nancy R, White, Scott R., Moore, Jeffrey S.
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Language:
english
Journal:
ACS Applied Materials & Interfaces
DOI:
10.1021/acsami.7b05266
Date:
May, 2017
File:
PDF, 1.35 MB
english, 2017
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