Heat dissipative Pb-free bonding technology using Al-rich Zn/Al/Zn clad solder
Yamaguchi, Takuto, Tohei, Tomotake, Ikeda, Osamu, Hata, Shohei, Oda, Yuichi, Kuroki, Kazuma, Kuroda, Hiromitsu, Hirose, AkioLanguage:
english
Journal:
Welding International
DOI:
10.1080/09507116.2016.1223227
Date:
May, 2017
File:
PDF, 2.63 MB
english, 2017