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Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps
Nakahira, KotaVolume:
134
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4006142
Date:
June, 2012
File:
PDF, 2.10 MB
english, 2012