Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests
Heilmann, Jens, Nikitin, Ivan, Zschenderlein, Uwe, May, Daniel, Pressel, Klaus, Wunderle, BernhardLanguage:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.04.016
Date:
May, 2017
File:
PDF, 3.86 MB
english, 2017