Electromigration reliability for Al2O3-reinforced...

Journal of Materials Science: Materials in Electronics 2017 / 2 Vol. 28; Iss. 3

Electromigration reliability for Al2O3-reinforced Cu/Sn–58Bi/Cu composite solder joints

Yang, Li, Ge, Jinguo, Zhang, Yaocheng, Dai, Jun, Jing, Yanfeng
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Volume:
28
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-016-5886-2
Date:
February, 2017
File:
PDF, 3.01 MB
english, 2017
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