A wafer mapping technique for residual stress in surface...

Journal of Micromechanics and Microengineering 2016 / 09 Vol. 26; Iss. 9

A wafer mapping technique for residual stress in surface micromachined films

Schiavone, G, Murray, J, Smith, S, Desmulliez, M P Y, Mount, A R, Walton, A J
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Volume:
26
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/26/9/095013
Date:
September, 2016
File:
PDF, 2.84 MB
english, 2016
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