[IEEE 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2014.10.22-2014.10.24)] 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - High density routing with electrical performance analysis using fine line package structure
Lin, Cheng-Hsun, Hsieh, Tsun-Lung, Huang, Chili-Yi, Cheng, Hung-Hsiang, Wang, Chen-ChaoYear:
2014
Language:
english
DOI:
10.1109/IMPACT.2014.7048399
File:
PDF, 1.43 MB
english, 2014