Fabrication and Comparison of Bumpless Wafer-on-Wafer...

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Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration

Guan, Yong, Zhu, Yunhui, Ma, Shenglin, Zeng, Qinghua, Chen, Jing, Jin, Yufeng
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Year:
2017
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2017.2695647
File:
PDF, 2.08 MB
english, 2017
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