![](/img/cover-not-exists.png)
Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration
Guan, Yong, Zhu, Yunhui, Ma, Shenglin, Zeng, Qinghua, Chen, Jing, Jin, YufengYear:
2017
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2017.2695647
File:
PDF, 2.08 MB
english, 2017