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Height Uniformity of Micro-Bumps Electroplated on Thin Cu Seed Layers
Yang, L., Slabbekoorn, J., Honore, M., Stiers, K., Struyf, H., Vereecken, P. M., Radisic, A.Volume:
72
Language:
english
Journal:
ECS Transactions
DOI:
10.1149/07204.0145ecst
Date:
May, 2016
File:
PDF, 459 KB
english, 2016