[IEEE 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) - Delft, Netherlands (2017.4.5-2017.4.7)] 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) - Thermal improvement of press-pack packages: Pressure dependent thermal contact resistance with a thin silver interlayer between molybdenum substrate and silicon carbide chip
Toth-Pal, Zsolt, Zhang, Yafan, Hammam, Tag, Nee, Hans-Peter, Bakowski, MietekYear:
2017
DOI:
10.1109/IWIPP.2017.7936753
File:
PDF, 410 KB
2017