[IEEE 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) - Delft, Netherlands (2017.4.5-2017.4.7)] 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) - Thermo-mechanical reliability analysis of flip-chip bonded silicon carbide Schottky diodes
Seal, Sayan, Wallace, Andrea K., Zumbro, John E., Mantooth, H. AlanYear:
2017
Language:
english
DOI:
10.1109/IWIPP.2017.7936756
File:
PDF, 787 KB
english, 2017