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[IEEE 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) - Delft, Netherlands (2017.4.5-2017.4.7)] 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) - Performance analysis of a SiC MOSFET half bridge power module with a Miller clamp
Martin, Daniel, Curbow, W. Austin, McNutt, TyYear:
2017
DOI:
10.1109/IWIPP.2017.7936765
File:
PDF, 402 KB
2017