[IEEE 2017 IEEE International Workshop On Integrated Power...

  • Main
  • [IEEE 2017 IEEE International Workshop...

[IEEE 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) - Delft, Netherlands (2017.4.5-2017.4.7)] 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) - Performance analysis of a SiC MOSFET half bridge power module with a Miller clamp

Martin, Daniel, Curbow, W. Austin, McNutt, Ty
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2017
DOI:
10.1109/IWIPP.2017.7936765
File:
PDF, 402 KB
2017
Conversion to is in progress
Conversion to is failed