Simplified Thermal Model of a Stacked Ball Grid Array...

Journal of Electronic Packaging 2011 Vol. 133; Iss. 2

Simplified Thermal Model of a Stacked Ball Grid Array Package

Colombo, Luigi P. M., Petrushin, Alexey, Paleari, Davide
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Volume:
133
Year:
2011
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4003991
File:
PDF, 813 KB
english, 2011
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