![](/img/cover-not-exists.png)
[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - A Study on Impact Stresses in Ceramic Capacitors
Kawakami, Takashi, Horikawa, Noriyo, Kinoshita, Takahiro, Inagaki, TomohiroYear:
2013
Language:
english
DOI:
10.1115/IPACK2013-73191
File:
PDF, 1.32 MB
english, 2013