Squeeze film air damping ratio analysis of a silicon capacitive micromechanical accelerometer
Mo, Yuming, Du, Lianming, Qu, BingBing, Peng, Bo, Yang, JieLanguage:
english
Journal:
Microsystem Technologies
DOI:
10.1007/s00542-017-3464-z
Date:
June, 2017
File:
PDF, 1.08 MB
english, 2017