Growth behavior and microstructure of intermetallics at...

Transactions of Nonferrous Metals Society of China 2017 / 05 Vol. 27; Iss. 5

Growth behavior and microstructure of intermetallics at interface of AuSn20 solder and metalized-Ni layer

WEI, Xiao-feng, ZHU, Xue-wei, WANG, Ri-chu
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Volume:
27
Language:
english
Journal:
Transactions of Nonferrous Metals Society of China
DOI:
10.1016/S1003-6326(17)60139-0
Date:
May, 2017
File:
PDF, 2.10 MB
english, 2017
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