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Contact Resistance Reduction Using Dielectric Materials of Nanoscale Thickness on Silicon for Monolithic 3D Integration
Kim, Seung-Hwan, Kim, Gwang-Sik, Oh, Seyong, Park, Jin-Hong, Yu, Hyun-YongVolume:
16
Language:
english
Journal:
Journal of Nanoscience and Nanotechnology
DOI:
10.1166/jnn.2016.13705
Date:
December, 2016
File:
PDF, 1.66 MB
english, 2016