![](/img/cover-not-exists.png)
A study on recovery of SiC from silicon wafer cutting slurry
Lee, Wei-Hao, Hsu, Chih-Wei, Ding, Yung-Chin, Cheng, Ta-WuiLanguage:
english
Journal:
Journal of Material Cycles and Waste Management
DOI:
10.1007/s10163-017-0591-7
Date:
February, 2017
File:
PDF, 2.70 MB
english, 2017