Effect of current density on the deposit stress in gold electroplating
Hou, Shuangyue, Xiong, Ying, Chen, Shan, Chen, Xiangyu, Xiong, Penghui, Tian, Yangchao, Liu, GangVolume:
31
Language:
english
Journal:
Modern Physics Letters B
DOI:
10.1142/s0217984917501883
Date:
June, 2017
File:
PDF, 992 KB
english, 2017