[IEEE 2017 International Conference on Electronics Packaging (ICEP) - Yamagata, Japan (2017.4.19-2017.4.22)] 2017 International Conference on Electronics Packaging (ICEP) - Developments of high precision printing processes for fabricating the flexible electronics
Ushijima, Hirobumi, Kusaka, Yasuyuki, Fujita, Mariko, Nomura, Ken-ichi, Kanazawa, Shusuke, Horii, Yoshinori, Abe, Koji, Yamamoto, NoritakaYear:
2017
DOI:
10.23919/ICEP.2017.7939413
File:
PDF, 676 KB
2017