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[IEEE 2017 International Conference on Electronics Packaging (ICEP) - Yamagata, Japan (2017.4.19-2017.4.22)] 2017 International Conference on Electronics Packaging (ICEP) - Newly developed silver nanoparticle ink for organic TFT circuits fabricated with high resolution printing system
Kumaki, Daisuke, Tokito, ShizuoYear:
2017
Language:
english
DOI:
10.23919/ICEP.2017.7939414
File:
PDF, 574 KB
english, 2017