[IEEE 2017 International Conference on Electronics Packaging (ICEP) - Yamagata, Japan (2017.4.19-2017.4.22)] 2017 International Conference on Electronics Packaging (ICEP) - Sub-micron printing technology using seamless roller mold (SRM)
Komatsu, Kazuma, Matsubara, Shinya, Hitomi, Taishi, Okuno, Kenjiro, Suzuki, Keita, Matsui, ShinjiYear:
2017
Language:
english
DOI:
10.23919/ICEP.2017.7939422
File:
PDF, 1.71 MB
english, 2017