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[IEEE 2017 International Conference on Electronics Packaging (ICEP) - Yamagata, Japan (2017.4.19-2017.4.22)] 2017 International Conference on Electronics Packaging (ICEP) - Effect of high temperature and humidity treatment on adhesion properties and bulk properties of structural adhesive
Tomita, Yugo, Shohji, Ikuo, Koyama, Shinji, Shimizu, SeigoYear:
2017
Language:
english
DOI:
10.23919/ICEP.2017.7939447
File:
PDF, 998 KB
english, 2017