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Mechanical properties of cured isotropic conductive adhesive (ICA) under hygrothermal aging investigated by micro-indentation
Xiao, Gesheng, Liu, Erqiang, Jin, Tao, Shu, Xuefeng, Wang, Zhihua, Yuan, Guozheng, Yang, XuexiaLanguage:
english
Journal:
International Journal of Solids and Structures
DOI:
10.1016/j.ijsolstr.2017.06.003
Date:
June, 2017
File:
PDF, 3.39 MB
english, 2017