Numerical modeling and validation of squeezed-film damping in vacuum-packaged industrial MEMS
Syed, Wajih U, Brimmo, Ayoola, Waheed, Owais, Bojesomo, Alabi, Ali, Mohamed Hassan, Ocak, Ilker, Chengliang, Sun, Chatterjee, Aveek, Elfadel, Ibrahim (Abe) MVolume:
27
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/1361-6439/aa71cb
Date:
July, 2017
File:
PDF, 3.17 MB
english, 2017