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[IEEE 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2016.7.18-2016.7.21)] 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Dynamic digital modulation thermal measurement for package fault isolation
Mohan, Aparna, Qiu, Wen, Zee, Bernice, Falk, R. A., Pham, TramYear:
2016
DOI:
10.1109/ipfa.2016.7564236
File:
PDF, 276 KB
2016