[IEEE 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2016.7.18-2016.7.21)] 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - High resolution 3D X-ray microscopy for streamlined failure analysis workflow
Liu, C. Y., Kuo, P. S., Chu, C. H., Gu, Allen, Yoon, JinYear:
2016
Language:
english
DOI:
10.1109/ipfa.2016.7564285
File:
PDF, 229 KB
english, 2016