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[IEEE 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2016.7.18-2016.7.21)] 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Asymmetric low temperature bonding structure using ultra-thin buffer layer technique for 3D integration
Liang, Hao-Wen, Yu, Ting-Yang, Chang, Yao-Jen, Chen, Kuan-NengYear:
2016
DOI:
10.1109/ipfa.2016.7564307
File:
PDF, 505 KB
2016