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[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - A modified water glass adhesive bonding method using spot pressing bonding technique
Xu, Yang, Wang, Shengkai, Wang, Yinghui, Chen, Dapeng, Jin, Zhi, Liu, XinyuYear:
2017
Language:
english
DOI:
10.23919/LTB-3D.2017.7947435
File:
PDF, 952 KB
english, 2017