Process technology for the modular integration of CMOS and...

Microsystem Technologies 1994 / 10 Vol. 1; Iss. 1

Process technology for the modular integration of CMOS and polysilicon microstructures

James M. Bustillo, Gary K. Fedder, Clark T. -C. Nguyen, Roger T. Howe
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Volume:
1
Language:
english
Pages:
12
DOI:
10.1007/bf01367758
Date:
October, 1994
File:
PDF, 2.84 MB
english, 1994
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