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[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - PoP assembly reliability test and assessment under random vibration loading
Xia, Jiang, Li, GuoYuan, Zhou, Bin, Cheng, LanXianYear:
2016
Language:
english
DOI:
10.1109/icept.2016.7583164
File:
PDF, 1.00 MB
english, 2016