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[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Investigation of a suitable material for automotive grade 0 requirement mitigating lead delamination
Descartin, Allen M., Lidong, Zhang, Jun, LiYear:
2016
Language:
english
DOI:
10.1109/icept.2016.7583236
File:
PDF, 2.52 MB
english, 2016