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[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects
Liang, Shui-Bao, Ke, Chang-Bo, Tan, Meng-Ying, Zhou, Min-Bo, Zhang, Xin-PingYear:
2016
Language:
english
DOI:
10.1109/icept.2016.7583260
File:
PDF, 1.39 MB
english, 2016