Characterization of materials and their interfaces in a...

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Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications

Kabaar, A. Ben, Buttay, C., Dezellus, O., Estevez, R., Gravouil, A., Gremillard, L.
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.06.001
Date:
June, 2017
File:
PDF, 2.22 MB
english, 2017
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