![](/img/cover-not-exists.png)
Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications
Kabaar, A. Ben, Buttay, C., Dezellus, O., Estevez, R., Gravouil, A., Gremillard, L.Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.06.001
Date:
June, 2017
File:
PDF, 2.22 MB
english, 2017