![](/img/cover-not-exists.png)
[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine Size, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration
Lee, K. W., Nagai, C., Bea, J. C., Fukushima, T., Tanaka, T., Koyanagi, M., Suresh, R., Xilinx, X. WuYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.10
File:
PDF, 1.82 MB
english, 2016