[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - In Situ Measurement of Stress Development in ECA for Die-Attachment of Electronic Devices
Moller, Eike, Schiffmacher, Alexander, Wijaya, Andi, Wilde, JurgenYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.105
File:
PDF, 980 KB
english, 2016