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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Robust and Low Cost TSV Backside Reveal for 2.5D Multi-Die Integration
Song, Chongshen, Wang, Lei, Yang, Yue, Wang, Zhun, Zhang, Wenqi, Cao, LiqiangYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.146
File:
PDF, 2.09 MB
english, 2016