[IEEE 2016 IEEE 66th Electronic Components and Technology...

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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Stacking of Insulating Substrates and a Field Plate to Increase the PDIV for High Voltage Power Modules

Bayer, Christoph Friedrich, Waltrich, Uwe, Soueidan, Amal, Baer, Eberhard, Schletz, Andreas
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Year:
2016
Language:
english
DOI:
10.1109/ectc.2016.40
File:
PDF, 770 KB
english, 2016
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