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[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Flow boiling of R245fa in a microgap with integrated staggered pin fins
Asrar, Pouya, Xuchen Zhang,, Woodrum, Casey D., Green, Craig E., Kottke, Peter A., Sarvey, Thomas E., Sitaraman, Suresh, Fedorov, Andrei, Bakir, Muhannad, Joshi, Yogendra K.Year:
2016
Language:
english
DOI:
10.1109/itherm.2016.7517656
File:
PDF, 1.34 MB
english, 2016