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[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Cooling of a Many-Core Multiprocessor: Experimental Results for OLTP Workloads
Sreenivasan, KrishnamacharYear:
2013
Language:
english
DOI:
10.1115/IPACK2013-73265
File:
PDF, 1.39 MB
english, 2013