A scratching force model of diamond abrasive particles in...

A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC

Wang, Peizhi, Ge, Peiqi, Li, Zongqiang, Ge, Mengran, Gao, Yufei
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Volume:
68
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2017.05.032
Date:
September, 2017
File:
PDF, 1.18 MB
english, 2017
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