A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC
Wang, Peizhi, Ge, Peiqi, Li, Zongqiang, Ge, Mengran, Gao, YufeiVolume:
68
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2017.05.032
Date:
September, 2017
File:
PDF, 1.18 MB
english, 2017