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[IEEE 2016 IEEE Industry Applications Society Annual Meeting - Portland, OR, USA (2016.10.2-2016.10.6)] 2016 IEEE Industry Applications Society Annual Meeting - An intercell busbar topology to improve resilience to anomalies of copper electrorefining process
Wiechmann, Eduardo P., Aqueveque, Pablo, Henriquez, Jorge A., Morales, AnibalYear:
2016
Language:
english
DOI:
10.1109/ias.2016.7731926
File:
PDF, 1.42 MB
english, 2016