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[IEEE 2016 12th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) - Lisbon, Portugal (2016.6.27-2016.6.30)] 2016 12th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) - A chip-level post-CMOS via-last Cu TSV process for multi-layer homogeneous 3D integration
Eroglu, Seniz E. Kucuk, Woo Yeong Cho,, Leblebici, YusufYear:
2016
Language:
english
DOI:
10.1109/prime.2016.7519491
File:
PDF, 690 KB
english, 2016