[IEEE 2016 12th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) - Lisbon, Portugal (2016.6.27-2016.6.30)] 2016 12th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) - A chip-level post-CMOS via-last Cu TSV process for multi-layer homogeneous 3D integration

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