Impurity Incorporation in the Cu Electrodeposit and Its...

Journal of The Electrochemical Society 2017 Vol. 164; Iss. 7

Impurity Incorporation in the Cu Electrodeposit and Its Effects on the Microstructural Evolution of the Sn/Cu Solder Joints

Lee, Hsuan, Yu, Tai-Yi, Cheng, Hsi-Kuei, Liu, Kuo-Chio, Chan, Po-Fan, Dow, Wei-Ping, Chen, Chih-Ming
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Volume:
164
Year:
2017
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/2.1171707jes
File:
PDF, 952 KB
english, 2017
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